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Yamaha Motor Co., Ltd. will release from July 1, 2012 the new automated X-ray and optical inspection system "YSi-X." This is a multi-function 3D X-ray hybrid-type inspection system capable of complete in-line inspection of all facets of printed circuit boards thanks to a 3D X-ray inspection function through newly developed Yamaha-exclusive high-speed X-ray laminography imaging technology and multiple inspection functions utilizing optics and lasers.
The YSi-X features 3D inspection algorithms as standard equipment for identifying defects such as insufficient solder joint, un-melted, openings, bridging, XY shifting, θ rotation, insufficient ball size, missing ball, and voids in ball. It also achieves the highest level of 3D inspection speed in the industry at 3.3 sec./FOV (under optimum conditions defined by Yamaha) due to new Yamaha-exclusive X-ray laminography imaging technology.
This model also boasts a hybrid design that couples 2D and 3D X-ray inspection functions, optical inspection and laser measurement function for height inspection to enable selection of the optimum measurement method for each part to be inspected, thus providing efficient, high-precision inspection. Because this hybrid capability eliminates the need for a separate optical inspection unit necessary in conventional lines, the new YSi-X also reduces overall investment for an SMT production line.
Furthermore, adoption of the latest technologies for the X-ray source and X-ray detector and the use of Yamaha-exclusive control technology has extended the full-operation life of the X ray tubes and the X-ray detector to a long life of four years. This greatly reduces the running cost for the X-ray source and the X-ray detector.
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