Release of the New Σ-G5S II Premium Modular Mounter, Rotary head design for a “1-head solution” with both high speed and versatility Improves productivity by approx. 20% with mounting speed of 90,000 CPH
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IWATA, January 11, 2018—Yamaha Motor Co., Ltd. (Tokyo: 7272) announces the April 1, 2018 release of the new Σ-G5S II, a surface mounter model that further improves upon the Σ-G5S premium modular mounter that achieved both high speed and versatility, and caters to various components with its rotary head design based on our “1-head solution” concept.
The Σ-G5S II retains all the features of its predecessor, including the high-speed high-accuracy rotary direct-drive head, the overdrive motion for highly efficient production by picking up components from either the front or rear feeder on the machine, and the Super Loading (SL) feeder that facilitates splicing-less*1 component supply. It also gains new head designs, an improved PCB feeding sequence, an enlarged internal buffer size for feeding larger PCBs and more to improve productivity. Additionally, its mounting speed of 90,000 CPH*2 (under optimum conditions)*3 represents an improvement of approximately 20% compared to the Σ-G5S.
Quality has also been improved by extending the detection range of components held by the mounter to immediately before placement. In addition, reliability has been further enhanced due to better balance for the beam motors to bolster stability, lower internal temperature by improving cooling performance, extending the service life of important components like the high-speed multi-purpose head and more.
The Σ-G5S II will be on display at the 47th Internepcon Japan electronics manufacturing and mounting technology exhibition to be held at the Tokyo Big Sight (Koto-ku, Tokyo) from January 17 to 19, 2018.
*1: Eliminates the need to splice new tape to the existing tape being used when feeding components into the tape feeder, the device feeding electrical components.
*2: CPH (Chips Per Hour): Total number of chips that can be mounted per hour (unit time). Indicates processing capacity under various conditions.
*3: Mounting capacity (CPH) under optimal conditions using a 2-beam high-speed multi-purpose head x 2